TDK贴片电容C2012X7R1H475K125AC
尺寸
| 长度(L) | 2.00mm +0.25,-0.15mm |
| 宽度(W) | 1.25mm +0.25,-0.15mm |
| 厚度(T) | 1.25mm +0.25,-0.15mm |
| 端子宽度(B) | 0.20mm Min. |
| 端子间隔(G) | 0.50mm Min. |
| 推荐焊盘布局(PA) |
1.00mm to 1.30mm(Flow Soldering) 0.90mm to 1.20mm(Reflow Soldering) |
| 推荐焊盘布局(PB) |
1.00mm to 1.20mm(Flow Soldering) 0.70mm to 0.90mm(Reflow Soldering) |
| 推荐焊盘布局(PC) |
0.80mm to 1.10mm(Flow Soldering) 0.90mm to 1.20mm(Reflow Soldering) |
电气特性
| 电容 | 4.7μF ±10% |
| 额定电压 | 50VDC |
| 温度特性 ? | X7R(±15%) |
| 耗散因数 (Max.) | 5% |
| 绝缘电阻 (Min.) | 106MΩ |
其他
| 温度范围 | -55～125°C |
| 焊接方法 | 流体回流 |
| AEC-Q200 | NO |
| 包装形式 | 塑封编带 (180mm卷筒) |
| 包装个数 | 2000pcs |